乐泰3220模组胶，乐泰3128低温固化胶，LOCTITE厂

供应乐泰乐泰单组份模组胶，低温固化黑胶、乐泰3128MSDS 乐泰3220 GSG 销售：137.5113.6332.0.7.5.5-8.9.3.7.9.1.9.6陈生 Q.Q：3022.24.564.网/址：w.w.w.a.a.l.o.c.t.i.t.e.c.o.m LOCTITE 3128 is a one part, heat curable epoxy. This product is designed to cure at low temperature and gives excellent adhesion on a wide range of materials in considerably short time. Typical applications include Memory cards, CCD/CMOS Assemblies. Particularly suited where low curing temperatures are required for heat sensitive components. TYPICAL PROPERTIES OF UNCURED MATERIAL Specific Gravity @ 25 °C 1.6 Yield Point, 25 °C, mPa Cone & Plate Rheometer 44,000 Casson Viscosity @ 25 °C, mPa·s (cP) Cone & Plate Rheometer 7,000 to 27,000LMS Pot life @ 25 °C, weeks 3 LOCTITE3220 With all curing systems, the time required for cure depends on the rate of heating. Cure rate depends on the mass of material to be heated and intimate contact with the heat source. Use suggested cure conditions as general guidelines. Other cure conditions may yield satisfactory results. The above cure profiles are guideline recommendations. Cure conditions (time and temperature) may vary based on customers' experience and their application requirements, as well as customer curing equipment, oven loading and actual oven temperatures.